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Qualifications 1. Hands on experience and knowledge of high density SMT assembly processes. 2. Understanding and experience developing high yielding soldering processes. 3.Experience leading, supervising, or managing technical resources. 4. Proven success working New Product Introduction (NPI) process, working closely with cross-functional depts on advanced technology products and assembly needs. 5.Bachelor's Degree in Electronics, Industrial, Manufacturing Engineering. 6.10-15 years’ Manufacturing or Process Engineering experience with an electronics manufacturer. 10 years’ automotive a plus, 5 years’ PCB preferred, 5 years’ R&D preferred. 7. Experience working as supplier in the automotive industry along with understanding of IATF 16949 a plus. 8.ECU experience a plus. Responsibilities 1.Provide guidance and support as lead for SMT and PCB assembly for Manufacturing Engineering on many new automotive, industrial and aerospace products. 2.Develop and retain a professional engineering team which can support the business processes and objectives. 3.Support cross-functional depts., clients for new project incoming in all stages, handle Project Cost and Budget evaluation. 4.Alternative, Local Source components selection. 5. Support execution of the manufacturing plan and lead its technical implementation where appropriate. 6.Make recommendations to enhance effectiveness of productivity, quality and safety. 7.Transition key issues such as quality, cycle time, cost reduction, continuous improvement into functional Engineering objectives. 8.Works closely with the Operations and Quality team in readiness preparing for IATF 16949 final certification. 9.Acts as an advisor to subordinate staff members on complex technical issues. 10.Position is a technical working engineer/manager role that will guide front line process developments and process improvements. 11.Defines and directs projects to identify and implement continuous yield and process improvements, leading to cost effective, high quality, high yield, and world class manufacturing capabilities. 12.Lead Engineering team to analyse and isolate root causes of process issues and develop and implement permanent solutions. 13.Implement new technology and equipment for process control and cost reduction. 14.Oversee and guide team to implement and manage real time SPC and utilize Six Sigma tools such as PFMEAs to implement meaningful process controls. 15.Team Forging, Building and Team Player. MinimumRequirements 1. Bachelor's Degree in Electronics, Mechanical, Industrial, Manufacturing Engineering. Master’s degree and/or MBA is a plus. 2. 8-10 years’ Manufacturing or Process Engineering experience with an electronics manufacturer. 2 years+ experience in a lead, supervisor or managerial role preferred. 5 years+ Automotive a plus 3. Solid experience monitoring and improving manufacturing processes using principles such as SPC, Six Sigma, Lean Manufacturing, Kaizen, etc. 4. Knowledgeable in Design for Manufacturability (DFM) and scale-up of product from NPI stage thru full volume production. 5. Thorough knowledge of related SMT materials and manufacturing processes. 6.Experience with the Automotive Requirements such as IATF 16949 Certification, PPAP a plus. 7. Familiarity with advanced packaging and processing strategies for system in a package devices (SIP) incorporating high layer count laminate (PCB) and ceramic substrates, ferrites, flip chips, BGA’s, lead-free soldering, MSL, transfer molding and encapsulation, high current interconnects a plus. 8. Good hands on engineering skills and experience working on production equipment. Excellent writing and organizational skills. Location: Dongguan City + Jing Zhou city Hubei